I'm not sure how you would calculate the ASF in the hole. Getting the
     area is no problem but from there I have no clue. Also how do oyu
     figure in the effect of the ground shield or circuits or pads.

     In answering the other part of your question the isolated pad has a
     much higher current density than the pad in the middle of shielding.
     This can and will cause plating distribution problems if you're not
     careful. The isolated pad plates at a higher rate and could burn if
     the ASF is not controlled properly.

     Mike Doty
     Hadco TCE


______________________________ Reply Separator _________________________________
Subject: [TN] ASF info...Super Plater
Author:  Robert Jordan <[log in to unmask]> at smtplink-hadco
Date:    10/19/99 7:45 AM


Hello,
Once again another question drawing in the vast talent and experience of
Technet. Is there a way to calculate the ASF inside a through hole in a
printed circuit board during the electroplate copper process? Is that ASF
different if the pth is in the middle of a ground plane vs. an isolated
area? If no formula exists please bend my ear with your opinion.

Thanks,
Bob Jordan

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