TECHNET Archives

October 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Robert Jordan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 19 Oct 1999 07:45:43 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (24 lines)
Hello,
Once again another question drawing in the vast talent and experience of
Technet. Is there a way to calculate the ASF inside a through hole in a
printed circuit board during the electroplate copper process? Is that ASF
different if the pth is in the middle of a ground plane vs. an isolated
area? If no formula exists please bend my ear with your opinion.

Thanks,
Bob Jordan

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2