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Does anyone have information about a possible alloy that might form when using
the electroless nickel, electroless palladium, immersion gold surface finish and
a solder alloy that might form with tin based solders.  Specifically, does
anyone have information or phase diagrams on the potential gold-palladium-tin
alloy that might form?  Any assistance or data would be appreciated.

Thomas A, Carroll
Hughes Space and Communications Co.
P.O. Box 92919   M/S - S41/A345
Los Angeles, CA 90009-2919
Phone: 310-662-9268
FAX:      310-416-6971
email:   [log in to unmask]

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