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October 1999

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Subject:
From:
Maryellen Hilderbrand <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 18 Oct 1999 09:56:50 -0500
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ONLY THE SMALL SURVIVE!
...especially when it comes to printed wiring boards.

Explore the material, design and processing alternatives that have already begun
revolutionizing substrate technology at IPC's

4th Annual National Conference on High Density Interconnect Structures (HDIS)
"Solutions for Ultra-High Density PWBs"
November 18-19, 1999
Renaissance Austin Hotel, Austin, TX

With Workshops on November 17, 1999:
  -HDI Design and Data Transfer
  -Fabricating Advanced PWBs Using Build-Up Technologies
  -High Performance, High Density Base Material Alternatives to FR-4
  -Lasers in PCB Manufacture

APPLYING MOORE'S LAW TO PRINTED CIRCUITS is not as farfetched as you might think. Can
the industry double or quadruple conductor, vias and land/pad density every year or
two, thus emulating Gordon Moore's famous prediction for transistors on a bare die?
More importantly, for those involved in HDI manufacturing: Will they need Moore's
law? Will the OEMs provide their suppliers with the economic motivation necessary to
drive the technology forward and production costs down?

IPC's Fourth Annual National Conference on High Density Interconnect Structures
(HDIS) will explore these questions and provide a comprehensive look into the future
of substrate technology. Along with OEM requirements, new dielectric materials,
fabrication processes, reliability testing and HDI standardization efforts will be
covered in the two-day technical conference. Wednesday workshops on material
alternatives, build-up processes, laser technologies and design for HDI will bring
you up to speed on all current options and manufacturing practices. This conference
will provide all the evidence you need to understand that in the world of portable,
consumer electronics "only the small survive!"

For a full conference brochure and registration information, visit the calendar of
events on our website at www.ipc.org or contact Leslie Zaitz at 847/790-5329 or by
e-mail at [log in to unmask]

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