Hi!
We put these components in a vacuum oven just in order to avoid intermetallics.
Gaby

Richard Tilbrook wrote:

> Steve,
> If you vacuum oven your boards (boiling off and evacuating any moisture),
> then open them into an environment, perhaps 22deg.C and 60%RH, won't the
> boards quickly absorb the moisture in that environment? If you then
> manufacture the boards, then ATE and inspect them, then conformal coat /
> dip them, you'll be sealing moisture in.
>
> I only ask because I am researching into moisture sensitive components,
> and one of the options is to put the components into a vacuum (oven /
> chamber).
>
> I am concerned that putting non-hermetically sealed electronics
> components (boards or devices) into a vacuum oven leads to little or no
> advantage, and only the acceleration of intermetallic formations between
> copper and tinned layer as a result.
>
> My question (finally) is would this be the case? Or would the rate of
> absorption be so slow that it wouldn't really matter?
>
> Regards,
>
> Richard Tilbrook
>
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