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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 14 Oct 1999 16:16:18 +0100 |
Content-Type: | text/plain |
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Steve,
If you vacuum oven your boards (boiling off and evacuating any moisture),
then open them into an environment, perhaps 22deg.C and 60%RH, won't the
boards quickly absorb the moisture in that environment? If you then
manufacture the boards, then ATE and inspect them, then conformal coat /
dip them, you'll be sealing moisture in.
I only ask because I am researching into moisture sensitive components,
and one of the options is to put the components into a vacuum (oven /
chamber).
I am concerned that putting non-hermetically sealed electronics
components (boards or devices) into a vacuum oven leads to little or no
advantage, and only the acceleration of intermetallic formations between
copper and tinned layer as a result.
My question (finally) is would this be the case? Or would the rate of
absorption be so slow that it wouldn't really matter?
Regards,
Richard Tilbrook
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