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October 1999

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Subject:
From:
"Ingemar Hernefjord (EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 15 Oct 1999 09:25:05 +0200
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  What experience do you have, TechNet members?  I'm sure many of you are active yourselves in this Lucent thing.  For selling more CADs  or making better technicians?/Ingemar


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Dear Colleague:

...2nd Announcement...
Lucent Technologies Hosted

First Ever
Paradigm Shifting Industry Initiative
Live IWPC EPDeS (tm) Demonstration
&
Interactive Technical Workshop

November 15-16, 1999
Murray Hill, NJ USA

To reserve your seat at this demonstration & workshop, please contact
Don Brown, TEL:  215-491-2113   [log in to unmask]

For Workshop & Hotel Details, go to:     <http://206.168.141.238/epdes_3_demo.htm> http://206.168.141.238/epdes_3_demo.htm

Please forward this announcement to an interested friend, colleague or supplier


Lucent Technologies and approximately 50 other companies at all levels of the supply chain (EDA Tool suppliers, OEM's, materials suppliers, circuit makers, component suppliers) will gather in Murray Hill, NJ, November 15-16, 1999 for the 3rd Electronic Product Design System (tm)  (EPDeS (tm)) Interactive Technical Workshop, organized by the International Wireless Packaging Consortium (tm) (IWPC (tm)), featuring the First Ever Live "Capability" Demonstration of this paradigm shifting industry initiative.

The EPDeS 3 Workshop follows the EPDeS 1 Workshop, hosted by Nokia Research Center, Helsinki Finland, October 1998 and the EPDeS 2 Workshop, hosted by Qualcomm Corp., February 1999, LaJolla, CA. This EPDeS demonstration represents the next step of literally hundreds of hours of intense industry discussions with virtually every level of the supply chain.

Join the following companies who will take an active role in this Live Demonstration (subject to change):
(in alphabetical order)

OEM's

        Lucent Technologies
        Nokia Corp.
        Qualcomm Corp.
        Raytheon Corp.

EDA Suppliers

        Ansoft
        CAD Design Software
        Cadence Corp.
        HP EESof
        Mentor Graphics
        SmartLynx Corp.

Materials Suppliers

        Dupont
        GIL
        Heraeus
        Rogers Corp.
        Taconic Corp.


Goal -- EPDeS Initiative:

To dramatically reduce time to market and reduce costs of wireless products...

...by providing the designer with everything s/he needs on the desktop, with a few mouse-clicks, to gain access to current and advanced materials data, design rules, models and component data, all in a format which can be used directly, by existing mechanical, thermal, electrical and EM design tools.   And, for EDA Tool files to be seamlessly transported from one EDA platform to another (mechanical, thermal, electrical and EM)


IWPC Interactive Technical Workshops are available to IWPC members only. IWPC Workshops are highly interactive and are attended by senior technology and business leaders who make a commitment to forwarding advanced packaging technology.


The International Wireless Packaging Consortium is a pro-active organization of WIRELESS AND RF OEM's and their SUPPLIERS, with 73+ members, worldwide. Our mission is to facilitate communication up and down the supply chain to:

        ** Reduce Costs
        ** Improve Performance
        ** Decrease Time to Market

...with an emphasis on packaging and interconnect technologies.

To reserve your seat, please contact:



Don Brown, Director
IWPC
TEL: 215-491-2113
FAX: 215-491-2115
[log in to unmask]
www.iwpc.org <http://www.iwpc.org/>

mailing address
1745 Appaloosa Rd.
Warrington, PA 18976 USA

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