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October 1999

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Subject:
From:
Timothy Reeves <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 14 Oct 1999 12:12:01 -0700
Content-Type:
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If the matte mask is peeling, the gloss LPI probably will too. It is likely
a surface contamination or prep problem, but other possibilities exist.
Matte LPI is known to reduce solder ball occurrence relative to gloss LPI.

Timothy Reeves
ECD Circuit Board Division
13626 South Freeman Road
Mulino, OR 97042
[log in to unmask]
(503) 829-9108 (800) 228-8198  FAX (503) 829-5482


> ----------
> From:         Guy Ramsey
> Sent:         Thursday, October 14, 1999 6:38 AM
> Subject:      matte vrs gloss LPI
>
> One of our suppliers of PWBs has requested and accross the board process
> deviation. They want (need?) to use gloss LPI instead of the matte finish
> that we specify on all our drawings. They are having problems with the
> matte mask peeling. I have no other details.
>
> We specify matte because it reduces inspector fatigue and improves vapor
> cleaning results (cosmetic).
>
> I have also heard that matte finish solder mask reduces solder balls in
> the SMT reflow process. I have no proof. Does any one know why this would
> be the case?
>

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