In a message dated 10/04/1999 1:59:00 PM Central Daylight Time,
[log in to unmask] writes:

<< Good afternoon everyone,

 We are looking into forming a 8 pin DIP to allow it to be
 surface mounted.  Does anyone know of a company that
 provides such a service?  I am also a little concerned with
 the surface mount pads providing sufficient support for the
 weight of a DIP package.  Has anyone successfully tried
 this?  If so, what was the end environment of the assembly?

 Thanks in advance,
 Gary Camac >>

Hi Gary!

I've placed DIP devices that were converted to SMT before...no problem. A
footprint does need to be made to accomodate it. The stuff they were on were
all class-II (consumer products). But the big question is; can the DIP device
that you wanna do stand the heat of reflow? Most PTH components can't. The
only reason we were able to do it was because the part body was ceramic. So
you might wanna make sure the part can take the heat...

-Steve Gregory-

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