I have heard the same. That matte reduces solder balls. (Retained flux) But
I also
heard that too much matte fails SIR. Is this all old news (straightening my
glasses)?

Dave
-----Original Message-----
From: Guy Ramsey [mailto:[log in to unmask]]
Sent: Thursday, October 14, 1999 6:38 AM
To: [log in to unmask]
Subject: [TN] matte vrs gloss LPI


One of our suppliers of PWBs has requested and accross the board process
deviation. They want (need?) to use gloss LPI instead of the matte finish
that we specify on all our drawings. They are having problems with the matte
mask peeling. I have no other details.

We specify matte because it reduces inspector fatigue and improves vapor
cleaning results (cosmetic).

I have also heard that matte finish solder mask reduces solder balls in the
SMT reflow process. I have no proof. Does any one know why this would be the
case?

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