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October 1999

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Subject:
From:
"Houston, Terri" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 14 Oct 1999 06:29:10 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (107 lines)
 Yuan, try Mr. Kim Blackwell at the IBM Endicott site. Email is
[log in to unmask]
  The main phone number is (607) 755-0123.

Good luck.

> ----------
> From:         LI YUAN[SMTP:[log in to unmask]]
> Sent:         Wednesday, October 13, 1999 4:55 PM
> To:   TechNet E-Mail Forum.; Houston, Terri
> Subject:      Re: [TN] IBM substrate for BGAS
>
> Someone from IBM contacted me on this substrate but I forgot getting his
> number. Would you please give me a call @ (408)544-7508?
>
> Sorry for bothering others.
>
> Yuan Li
>
>
> On Fri, 1 Oct 1999, Houston, Terri wrote:
>
> > Hi Yuan, try:
> > http://www.chips.ibm.com/products/interconnect/documents/pks037400.pdf
> >
> > > ----------
> > > From:         LI YUAN[SMTP:[log in to unmask]]
> > > Reply To:     TechNet E-Mail Forum.;LI YUAN
> > > Sent:         Friday, October 01, 1999 1:43 PM
> > > To:   [log in to unmask]
> > > Subject:      [TN] IBM substrate for BGA
> > >
> > > Good Friday,
> > >
> > > I am not be able to get through to the Technet from my email account
> at
> > > the company, so i am using my old account at school. We are constantly
> > > looking at substrate technologies in our company. I came across one
> > > article in a recent issue of Semiconductor International which has
> > > information on an IBM substrate from IBM Microelectronics: "IBM
> > > Interconnect Products recently introduced an organic substrate,
> > > called a high-performance chip carrier (HPCC), with a CTE of
> 12x10-6/K. It
> > > has a closer match to silicon than most organic-based substrate
> materials"
> > >
> > > Do anyone know where to find more information? You can contact me @
> > > 408-544-7508 if you want.
> > >
> > > Thanks,
> > >
> > >
> > > Yuan Li
> > >
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