Rick,
Is it irrespective of prior baking and vacuum sealing that part must be
baked before placement/reflow?
We have seen a recent problem on our board with CSP that unbaked parts
created solder bridges. The very next kit we ran, we baked parts and found
no defect. Meaning what you are saying is true.
re,
ken patel
At 01:44 PM 10/8/1999 -0700, Rick Thompson wrote:
>Richard,
>
>Check out the Jedec J-STD-033 ( http://www.jedec.org ). Level 6 parts are
>listed as requiring a mandatory bake prior to reflow. Moisture barrier bags
>and humidity indicator cards are listed as optional. My interpretation of
>this is that while you may want to seal the parts for other reasons, such as
>maintaining lead solderability, it's not required for moisture sensitivity
>reasons alone.
>
>Regards,
>
>
>Rick Thompson
>Ventura Electronics Assembly
>2665A Park Center Dr.
>Simi Valley, CA 93065
>
>+1 (805) 584-9858 voice
>+1 (805) 584-1529 fax
>[log in to unmask]
>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]]On Behalf Of <Richard Tilbrook>
>Sent: Friday, October 08, 1999 12:37 AM
>To: [log in to unmask]
>Subject: [TN] level 6 moisture sensitive smt components
>
>
>Hi,
>
>I am enquiring into the acceptable conditions [ie. temp. and Relative
>Humidity] for long term storage [ie. 8 to 10 months] of level 6 moisture
>sensitive smt components.
>
>I am aware that moisture sensitive components of levels 2 through 5 require
>an RH of less than or equal to 20% RH for long term storage, but does this
>apply to levels 5a and 6, or is a lower RH necessary? I ask as I have no
>level 5a information to check on, and level 6 information is individual to
>the component.
>
>Thankyou for taking the time to read this,
>
>Regards,
>
>Richard Tilbrook,
>Junior Engineer,
>British Aerospace.
>
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______________________________________________________
Ken Patel Phone: (408) 490-6804
1708 McCarthy Blvd. Fax: (408) 490-6859
Milpitas, CA 95035 Beeper: (888) 769-1808
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