Someone from IBM contacted me on this substrate but I forgot getting his
number. Would you please give me a call @ (408)544-7508?

Sorry for bothering others.

Yuan Li


On Fri, 1 Oct 1999, Houston, Terri wrote:

> Hi Yuan, try:
> http://www.chips.ibm.com/products/interconnect/documents/pks037400.pdf
>
> > ----------
> > From:         LI YUAN[SMTP:[log in to unmask]]
> > Reply To:     TechNet E-Mail Forum.;LI YUAN
> > Sent:         Friday, October 01, 1999 1:43 PM
> > To:   [log in to unmask]
> > Subject:      [TN] IBM substrate for BGA
> >
> > Good Friday,
> >
> > I am not be able to get through to the Technet from my email account at
> > the company, so i am using my old account at school. We are constantly
> > looking at substrate technologies in our company. I came across one
> > article in a recent issue of Semiconductor International which has
> > information on an IBM substrate from IBM Microelectronics: "IBM
> > Interconnect Products recently introduced an organic substrate,
> > called a high-performance chip carrier (HPCC), with a CTE of 12x10-6/K. It
> > has a closer match to silicon than most organic-based substrate materials"
> >
> > Do anyone know where to find more information? You can contact me @
> > 408-544-7508 if you want.
> >
> > Thanks,
> >
> >
> > Yuan Li
> >
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To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################