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October 1999

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From:
Paul Klasek <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 13 Oct 1999 09:36:32 +1000
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Have little to add to Robert's , as Earl said .
That is what i meant saying the Ni is gone .
To Paul's : heard the phosphorus limit in bath should be kept below 5% ?
Is that realistic ?

Paul Klasek
ResMed

-----Original Message-----
From: Hollandsworth, Ron [mailto:[log in to unmask]]
Sent: Tuesday, 12 October 1999 22:53
To: [log in to unmask]
Subject: Re: [TN] Black Plague
Importance: Low


Franklin, POD, & Paul
You say there are ways to get around the Black Plague.  Would you elaborate
please.  Once again I see messages where others are experiencing this
problem but no absolute solutions.  I have read the articles, tried the
erasers, stronger fluxes, and pad scraping.  No relief.  I have learned to
dislike Electroless Ni/ Immersion Au boards.  I am thinking that HASL or
precision pad technologies are much better.  At least you can perform your
soldering operation.  A Circuit Card Assembly (CCA) with the Black Plague
can run up scrap costs real fast.  Not to mention the possibility of late
shipment to the customer because of inability to solder. This is a real
problem if you are using Ni/Au boards.  So far there are few comments and
the issue simply drops out of sight.  Are platers/fabricators not
controlling their processes or is this a inhouse process issue.  We have
checked our processes and find no change.

Ron Hollandsworth

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