I can't give a blanket answer.  I've observed film stresses to be 1e3 higher
than equivalent bulk metals can endure without coming apart.  I don't have
pull strength data because I've never wanted to compare them.

You need to go understand what happened far back before the Au coating step
for the bond process.

Carey
-----Original Message-----
From: Ingemar Hernefjord (EMW) <[log in to unmask]>
To: 'Carey Pico' <[log in to unmask]>; TechNet E-Mail Forum. <[log in to unmask]>;
Nicholas LAI <[log in to unmask]>; Christian Skeppstedt (EMW)
<[log in to unmask]>; Ingemar Hernefjord (EMW)
<[log in to unmask]>
Date: Monday, October 11, 1999 8:32 AM
Subject: RE: [TN] COB,FP,TAB/Wire bond/plasma clean


>Carey, me again.
>
>a) What kind of films then? Can you tell more? Have you any report? You
said A, now say B.
>b) You mean that microwelds can not be created?
>
>/Ingemar
>
>
>  Thin films
>and interfaces can be extremely strong.  The strength of thin films can be
>1000X higher than bulk equivalents and their other properties (e.g.,
>electrical) vary as well with thickness.
>Carey
>
>

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