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FOR EARL:

H-P is, of course, a no name company as an 8 billion dollar IPO after being
dumped by parent, but everyone knows that. I agree this facility has some
great experience. After all, in the business they're in, they'd better. Another excellent shop is Hewlett-Packard (name changed recently???) in
> Santa Rosa.  They know plating better than any one I know (including IBM)

YOU ARE RIGHT, EARL, AND WE HAVE HP PEOPLE ACROSS THE STREET, WHY DIDN'T YOU SAY THAT BEFORE (HE-HE). / TXS / INGEMAR

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> FOR DR JK:


> >(1) pay IBM ($)for Failure analysis...If it is SIR type of test vehicle
> >(with daisychain), I think you may need LSI tester to pin point where is
> the
> >leak or short.  I believe they have a component lab and FA lab for doing
> >outside work (at least used to be).
> >(2) Pay IBM well ($$) for root cause analysis (you may have to open your
> >material/process in order to get some real benefit of root cause.
"Window
> >dressing" will lead you more costly FA).
> >(3) Pay IBM more (big time $$$$) for training some of your personnel to
do
> >proper FA.  (be willing to spend sleepless nights to make sure you
> >understand the steps and why!)...send someone with background in FA and
> >design/process...Believe me, it is a good investment...You may have to
sign
> >some non-disclosure agreement.. watch what you sign...(you may sign off
> your
> >day dream and nightmare too)..

YOU SURE HIT THE NAILHEAD, JK, WE LACK KNOWHOW, ADMIT, ADMIT,ADMIT. CONTACTED IBM AND LEARNED THAT THEY HAVE BEEN BUSY FOR MANY YEARS CONCERNING MY MATTER. ONE OF THEIR REPORTS "FABRICATION AND PERFORMANCE STUDIES OF MULTILAYER PI/METAL INTERCONNECTS STRUCTURES FOR PACKAGING APPLICATIONS" GAVE INSIGHT. ALSO ANALYSIS GUY NAMES AT IBM: DI CESARE, KIMBALL AND GOLDSMITH.


> >(4) look like so far the only 2 people replied your e-mail are Dr.s! stop
> >bashing us... you may need us someday (like as a drinking buddy). jk

  BASHING DOCTORS....MAY THE GROUND OPEN UNDER ME AND THE HEAVEN FALL DOWN FOR SAYING THAT.

  BUT I WAS RIGHT... NO-NO-NO JK, STOP, DON'T JUMP THAT HIGH AGAIN, THAT WAS A JOKE.


  The End / Ingemar





> >>Guten Wienerschnitzel, netters,
> >>challenge for an IBM-guy if he reads (no, of course he doesn't, big Blue
> >too big) , maybe my mate and competitor Bev can rise his eyebrow and move
> >his finger to the keyboard. Topic: multilayer 3D "boards" with IBMs
liftoff
> >and PI dielectric. Reactive Ion etch (O2/He RIE) through mask for
removing
> >PI, followed by WSiN sputter for biting and low current electroplating
for
> >first step making the vias. Vias are finally O2 plasma, SF6 RIE'd. Now,
> most
> >seems maybe familiar to you, but, the problem is that the conductors are
> >only 4um wide and the vias 1um in diameter. Test "board" consists of
single
> >to two layers with very short conductors, daysichained, let's say a
hundred
> >such strips. See it in front of you: gold, under is the via, via goes
> >horizontally some um, goes up to next gold, .. up, down, up down, like
> >chaining an ordinarey PWB, but one decade smaller. And, PI is the
> >dielectric, approx 2um thick. Now, palomas, the Q:
> >>when these "boards" are temcycled we get interrupts somewhere in the
> >daisychain, seen as RF signal anomalies. How on earth do we analyse?
> >Ordinary SEM of surface tells nothing of what's under the conductor.
> >Finefocus Xray has unsufficient resolution for finding microcracks.
> >Sonoscan, no. Cross-sectioning, no, weeks of job, little chanse of
finding
> >rupture. Reactive etching will heat and possibly take both Gold and PI.
Wet
> >etching, e.g. KaC? Takes Au, but what do you do with the W under Au?
Agree,
> >more like semiconductor techs.
> >>
> >>Oftenly when we have to do with the japs, we describe with hands, paper,
> >mail, photos and words, and they reply 'yes', 'yes', which is oftenly of
> >little help. So, Bev (I'm sure you have a recipe in your pocket) and
like,
> >what do I do with the drunken saylor?
> >>Aussilek, give up, you can't be specialist on everything, you must have
> >some limitation, please, tell that you are a human and not a Cray. (on
that
> >isle you may say crayfish, I don' t know).
> >>
> >>Cu?
> >>
> >>Ingemar Hernefjord
> >>Ericsson Microwave Systems
> >>
> >>PS. With HISTACK, I mean that our test samples remind of this EU-thing,
> but
> >does not belong to EU at all.

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