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October 1999

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From:
"Ingemar Hernefjord (EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 11 Oct 1999 12:22:40 +0200
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-------------------------------------------------------------------------
We've had good look locating shorts/leakage with IR imaging.  Our
camera/software (Inframetrics) supports a comparison of the thermal delta
between different assemblies -- super discriminating.

WHAT IS THE RESOLUTION OF YOUR CAMERA? IS IT IN THE MICRON-RANGE? / INGEMAR
---------------------------------------------------------------------------

FOR ROGER @ MOTA:

>     Ingemar,
>
>        Dont know if its too late to offer anything on this (been away a
>     couple of days), but if the parts a "daisy chain" cant you identify
>     roughly where its failed, and then cross section real careful about
>     that area only?
>        I dont know if it will work, but have you considered dye
>     penetration? I guess this needs a crack up on the surface to allow
>     penetration but you may be lucky?

      TOO TINY THINGS, ROGER.




>        Other possible ideas, but Im really starting to clutch at straws
>     are Eddy Current methods, unsure of detection limit or noise
>     effects due to feature size?
      DID NOT WORK, I DON'T KNOW WHY, ROGER.



>                Acoustic routes, which work on the idea that flaws in
>     joints etc generate microsound waves under thermal loading, again,
>     dont know if its suitable, but find an expert and ask them
      TOO SMALL DIMENSIONS, WE TRIED SONOSCAN, IMAGES A MESS, ROGER.


>
>                If all else fails you could try asking somebody like the
>     Institute of None Destructive Testing, Never used them myself, but I
>     guess they do destrucive methods to, find them at
>                http://www.bindt.org/
      NOR HAVE I, WILL SEND A Q TO THEM

>
>
>          Good luck, and let us know if you get anywhere, never know when
>     we need to find the needle in the haystack.
      AS IS SAID IN CLOSE PRIM, WE THINK PI WILL ABSORB HUMIDITY, SWELL AND CAUSE
      DELAMINATION.THEN THE VIAS WILL GET HURT. SO, CREATING PASSIVE COMPONENTS ON A SIGE
      SUBSTRATE IS PERHAPS NOT SO GOOD WITH PI AS DIELECTRIC. AS PI IS A WHOLE BUNCH OF
      POLYMERS, MAYBE THERE ARE SOME BETTER THAN THE ONE WE GOT.
      WE HAVE GOT TIPS FROM A UNI IN MARYLAND, THE JAPANESE COMPANY THAT IS INVOLVED WILL
      MAKE THE REST OF THE ANALYSIS. MMICS ARE MAYBE NOT THE CORRECT ISSUE TO DISCUSS
      IN THIS FORUM, APOLOGIZE.

>
>
>          Roger
>          Motorola AIEG

      THANKS FOR  ASSISTING, ROGER / REGARDS/
      INGEMAR HERNEFJORD
      ERICSSON MICROWAVE SYSTEMS
>

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