Hi both and all, are these substrates really new? Seem familiar. Have not IBM presented these nearly ten years ago? I have an additional Q: have anyone used these for GaAs applications? Datasheet did not tell about CTE. /Ingemar

Hi Yuan, try:
http://www.chips.ibm.com/products/interconnect/documents/pks037400.pdf

> ----------
> From:         LI YUAN[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;LI YUAN
> Sent:         Friday, October 01, 1999 1:43 PM
> To:   [log in to unmask]
> Subject:      [TN] IBM substrate for BGA
>
> Good Friday,
>
> I am not be able to get through to the Technet from my email account at
> the company, so i am using my old account at school. We are constantly
> looking at substrate technologies in our company. I came across one
> article in a recent issue of Semiconductor International which has
> information on an IBM substrate from IBM Microelectronics: "IBM
> Interconnect Products recently introduced an organic substrate,
> called a high-performance chip carrier (HPCC), with a CTE of 12x10-6/K. It
> has a closer match to silicon than most organic-based substrate materials"
>
> Do anyone know where to find more information? You can contact me @
> 408-544-7508 if you want.
>
> Thanks,
>
>
> Yuan Li
>
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