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October 1999

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Subject:
From:
Richard Mazzoli <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 1 Oct 1999 07:06:14 EDT
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Hi Eric,

Two thoughts;

First, look at oxide and reducer baths.  Could have floating debris that is
becoming lodged between traces.  Even if these pieces weren't originally
metal they could become metalized through the oxide and subsequent conversion
step.

Second, and most obvious, would be to look for signs of over etch on cores
which may be generating slivers of copper.  If you're using 1 oz. copper this
would be more of a problem than on thinner copper laminates.  Escaping AOI is
normal if they're smaller than your settings would pick up or the slivers are
forming after AOI, say even during the press cycle itself.

Good luck.

Mark Mazzoli
[log in to unmask]

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