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October 1999

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 8 Oct 1999 13:47:01 EDT
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In a message dated 10/07/99 15:13:22, [log in to unmask] writes:

>We have sporadic problems with the copper level rising in our solder pot.
>We reduce the temp and dross each morning. Could you recommend a specific
>PM program to keep our SnPb clean? We believe per the certicates of analyses
>that our supplier gives us good product. Any other reasons it might rise?
>Green

Hi 'Green,'
Of course there is a reason that your Cu level in your solder pot. soldering
requires that the base metal you solder to (in your case copper) dissolves in
the tin (for Sn-based solders). This causes the formation of the
intermetallic layer(s) on your exposed Cu (indicating a good metallurgical
bond) as well as some dragging-in of Cu into your pot. What you need to do
periodically is to replace the content of your solder pot (it typically can
be reclaimed at your supplier). If you do not do this, your HASLed solder
will get significantly worse with time (depending on through-put).

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com

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