------- Forwarded Message Follows -------
From:          Self <RobertsK.Eng.Perth.UK>
To:            [log in to unmask]
Subject:       Topside wetting on Gold PCBs
Reply-to:      [log in to unmask]
Date:          Thu, 7 Oct 1999 17:13:56 GMT

Hi,

I am currently processing an immersion gold finished card through
bottom side glue, topside reflow then wave solder.
The problem I am seeing is solder is not flowing through to the
topside leaving many PTH parts with very little hole fill. The wave
solder is an Electrovert Ultrapak with  econo spray fluxer twin
preheats and dual wave.
I have tried running the boards through an older machine which has a
foam fluxer and this gave improved results but still not perfect.

Has anyone seen a similar condition and what was the solution.

Ken Robertson

Telspec Scotland Ltd.

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