Dear Ingemar,
sorry to add some "garbage" mail to the many replies, but you are wrong
about the green Chartreuse!
Ioan is dreaming about a nice glass of PALINCA right now, or am I wrong?
Gaby
> ----------
> From: Ingemar Hernefjord
> (EMW)[SMTP:[log in to unmask]]
> Reply To: TechNet E-Mail Forum.;Ingemar Hernefjord (EMW)
> Sent: ?יום רביעי 06 אוקטובר 1999? 14:48
> To: [log in to unmask]
> Subject: Re: [TN] Cold solder epilogue... maybe
>
> Interesting, Juan...
>
> by the way, did you make the wetting test? I'm curious.
> And what's wrong with tea, you need sip something besides the green
> Chartreuse.
> See you Huan..
>
> Ingemar
>
>
> -----------------------------------separator------------------------------
> --
>
> Thanks for the interest and thoughtfulness.
>
> There are three things I would like to clarify:
>
> - first, my identity, the name is IOAN, starts with an I, the letter after
> H. Some of you passed this test;
>
> - second: tea, grog, etc is not exactly my kind of stuff; where I come
> from
> we go for strong licors;
>
> - third: looks like the hours I spend reading through e-mails are very
> precious. Being in contact with people of your expertise is a big chance
> for
> me.
>
> So, after getting some of the hints on the Technet, I realized that,
> indeed,
> it's not cold solder, but the dull, grainy joints that IPC-610 accepts for
> this kind of boards.
>
> Did this solve my problem? Maybe. Now I have this phenomenon labeled as
> process indicator by the QA. This adds to the other process indicator, the
> solder joints that don't have 100% filling. The same IPC-610 accepts 50%,
> so
> we are going to make some cross sectioning.
>
> The thing is I have two process indicators that are getting worse. More
> grainy joints, more not-so full joints. I wonder where will this lead.
>
> Why do we do two passes? We couldn't avoid damaging the board with only
> one
> pass, simply, the board wouldn't preheat enough to avoid the thermal shock
> when hitting the wave. If we set the preheaters higher, the passive
> components will go out of spec.
>
> Thanks again,
>
> Ioan
>
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