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October 1999

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Subject:
From:
"Hollandsworth, Ron" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 1 Oct 1999 13:42:06 -0500
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Nancy:
I would contact Terry Munson at Contamination Studies Laboratories, Inc., on
this problem.  Terry and his crew are very apt at troubleshooting this
scenario and provide a ton of information.  CSL's e:mail is
[log in to unmask]    Telephone number is (765) 457-8095.

A couple of questions that may be ask is what type flux are you using?  Do
you do any cleaning?  If so, what type solvent/cleaning fluid is being used?
How much handling is being done for boards, components, in your
manufacturing process?  What type/method of storage condition from bare
board to completed assemblies.  Soldering processes, repair processes, and
do you take ionic cleanliness readings any where in the process?  Board
functional specifics on voltage, current, pad and trace spacing.  Is the
board(s) exposed to any kind of moisture?

Ron



-----Original Message-----
From: Nancy Trumbull [mailto:[log in to unmask]]
Sent: Friday, October 01, 1999 9:11 AM
To: [log in to unmask]
Subject: [TN] Electrical Migration


Hi Every One.

I need information on Migration

Question
1.  What will cause Electrical Migration

Reason :

We are seeing Dendritic Migration between components

As of now we are applying conformal coating trying to stop the migration.

Question:

1. Is there a rework to prevent this condition.

2.  Any study or data out there on reliability as far as using this method
to stop the migration.


Any information at all will be greatly appreciated.
If more information is needed please ask.  This is all I know as of now
I will do my best to get what ever is needed.

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