I also did this at a previous employer. They were leadformed on an arbor press.

End use were HVAC controllers.

Aric Parr
Sr. Process Engineer
Eaton Corporation
1400 S. Livernois
PO Box 5020
Rochester Hills, MI 48308-5020
248 608 7780
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---------- Original Text ----------

From: C=US/A=INTERNET/DDA=ID/TechNet(a)IPC.ORG, on 10/5/99 9:08 AM:

Gary..
          I think my first attempted message died at
  our *&%^%&) server, so I'll try again!!
          At my previous employer, who will remain
  unnamed, if we had a SMT assembly with a few thru
  holes components, we would take the non-SMT components
  and form them into SMT configurations. You know how
  those spoiled assembliers get if you make them have
  to work(Hey Steve, Kelly, etc only joking about the
  spoiled). We would take 48 pin dips and reconfigure
  them, with a universal bending tool, into 48 lead
  gull wing parts- never wanted to attempt j-lead. If
  we had unique axial components, we would also convert
  them into SMT parts by bending the leads - anything
  to make the assembliers HAPPY ;->. This hardware was
  in military avionics equipment that was then subjected
  to all the qual testing without problems. Final
  assemblies were conformal coated - acrylic.
     That being said, we were not in high productions.
  We would have 6-8 parts on each assembly with 3-4
  assemblies per system in 30 systems and 90 systems-
  2 different contracts. All went well.
      Good luck and have a great day.
                                         Regards,
  Bob Vanech                                      Bob
  BVAN Enterprise
> Good afternoon everyone,
>
> We are looking into forming a 8 pin DIP to allow it to be
> surface mounted.  Does anyone know of a company that
> provides such a service?  I am also a little concerned with
> the surface mount pads providing sufficient support for the
> weight of a DIP package.  Has anyone successfully tried
> this?  If so, what was the end environment of the assembly?
>
> Thanks in advance,
> Gary Camac
>
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