Bill,

I believe that intrusive reflow is what is also referred to as
paste-in-hole.  Basically, this is a means of reflowing, rather than wave
soldering or hand soldering, through-hole parts.  This is often used on
boards with lots of SMT parts and a small number of through-hole parts.
Using intrusive reflow here allows you to perform just one soldering process
(reflow) rather than several.  Solder paste is deposited around the hole
(when the paste is deposited for the SMT pads), the through-hole is placed
in the holes (and the SMT parts are placed as well) and the board is
reflowed.

I understand that one of the tricks is depositing the proper amount of
solder paste to achieve a good solder joint.  There have been a number of
articles in industry magazines describing this.  The other catch is to make
sure that the through-hole part you are trying to solder can withstand the
heat of the reflow oven.  SMT parts are designed to do so, some through-hole
parts are not.

Hope this helps.

-Steve


Steven K. Lustig
Process Engineer
EMS Technologies, Inc.
Norcross, GA
(770) 263-9200 x4714
[log in to unmask]


-----Original Message-----
From: William Anderson [mailto:[log in to unmask]]
Sent: Wednesday, October 06, 1999 8:43 AM
To: [log in to unmask]
Subject: Re: [TN] connectors and intrusive reflow


Hi, gang.

You assembly people just used another term alien to us board guys.  What
is "intrusive reflow"?

Thanks.

Bill Anderson
Kinetic Circuits

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