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October 1999

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Subject:
From:
"Ingemar Hernefjord (EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 6 Oct 1999 14:48:07 +0200
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Interesting, Juan...

by the way, did you make the wetting test? I'm curious.
And what's wrong with tea, you need sip something besides the green Chartreuse.
See you Huan..

Ingemar


-----------------------------------separator--------------------------------

Thanks for the interest and thoughtfulness.

There are three things I would like to clarify:

- first, my identity, the name is IOAN, starts with an I, the letter after
H. Some of you passed this test;

- second: tea, grog, etc is not exactly my kind of stuff; where I come from
we go for strong licors;

- third: looks like the hours I spend reading through e-mails are very
precious. Being in contact with people of your expertise is a big chance for
me.

So, after getting some of the hints on the Technet, I realized that, indeed,
it's not cold solder, but the dull, grainy joints that IPC-610 accepts for
this kind of boards.

Did this solve my problem? Maybe. Now I have this phenomenon labeled as
process indicator by the QA. This adds to the other process indicator, the
solder joints that don't have 100% filling. The same IPC-610 accepts 50%, so
we are going to make some cross sectioning.

The thing is I have two process indicators that are getting worse. More
grainy joints, more not-so full joints. I wonder where will this lead.

Why do we do two passes? We couldn't avoid damaging the board with only one
pass, simply, the board wouldn't preheat enough to avoid the thermal shock
when hitting the wave. If we set the preheaters higher, the passive
components will go out of spec.

Thanks again,

Ioan

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