Green,

Mike Barmuta gave you a very good reply.  I just wanted to add that your plating
time depends on the actual aspect ratio of the panels you are plating.  The
higher the aspect ratio -- the lower the current density you will have to apply
to get a minimum of 1 mil copper deposit in the center of the high aspect ratio
holes without grossly overplating isolated pads/traces on the surface.
(Actually, a thicker panel at equal aspect ratio is more difficult to plate then
a thinner one.)  I'm not sure what you call "moderate difficulty", but I'd say
you should be able to plate up to 4:1 aspect ratio panels at 30 ASF in about
45-50 min. depending on your minimum copper thickness requirements.

Eric Yakobson
Alpha PC Fab




Julie Dixon <[log in to unmask]> on 10/07/99 12:12:32 PM

To:   [log in to unmask]
cc:    (bcc: Eric Yakobson/AlphaPCFabUS/Cookson)
Subject:  [TN] plating times for pcb's




Dear Technet,

For a small shop without automation or ppr, what is a standard time
acceptable to
plate moderate to low difficulty double- sided boards to 1 mil with a
standard acid copper plating solution?
Our vendor can offer us a different brightner system, etc., I was just
looking for a
norm. We can make adjustments to speed our cycles, but we give up even
distribution.

Thanks,
Green

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