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October 1999

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Sender:
TechNet <[log in to unmask]>
Date:
Mon, 4 Oct 1999 13:56:42 -0500
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Gary Camac <[log in to unmask]>
Subject:
Forming DIP for Surface Mounting
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Organization:
DICKEY-john Corp.
From:
Gary Camac <[log in to unmask]>
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text/plain (26 lines) 
Good afternoon everyone,

We are looking into forming a 8 pin DIP to allow it to be
surface mounted.  Does anyone know of a company that
provides such a service?  I am also a little concerned with
the surface mount pads providing sufficient support for the
weight of a DIP package.  Has anyone successfully tried
this?  If so, what was the end environment of the assembly?

Thanks in advance,
Gary Camac

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