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October 1999

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TechNet <[log in to unmask]>
Subject:
Outer layer annular ring capability
From:
"Joy, Stephen C" <[log in to unmask]>
Date:
Wed, 13 Oct 1999 07:40:59 -0700
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"TechNet E-Mail Forum." <[log in to unmask]>, "Joy, Stephen C" <[log in to unmask]>
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What is the capability for drilling a .0135" or so hole in a pad? Assuming
tangency, how good is registration for a standard pc motherboard form
factor? Is automated better than eye aligned? Is solder mask the same as
outer layers in terms of registration?
Thanks,
Steve

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