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October 1999

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Subject:
From:
Carol Handwerker <[log in to unmask]>
Reply To:
Leadfree Electronics Assembly E-Mail Forum.
Date:
Tue, 5 Oct 1999 14:42:23 -0400
Content-Type:
text/plain
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text/plain (102 lines)
Another question is whether they thermal cycled test boards to electrical
failure. In the NCMS project we found that just looking at cross sections
was not enough: to discriminate between lead-free alloys and to compare
with Pb-Sn eutectic, testing to electrical failure (getting some Weibull
statistics) was needed.  The electrical failure results in many cases were
different from the relative amounts of damage seen in the cross sections.

 At 09:36 AM 10/05/1999 -0700, Jong-Kai Lin wrote:
>Sony announced this new alloy one year ago (Sep/Oct, 1998), not
>recently!
>It was Sn-2Ag-4Bi-0.5Cu-0.1Ge. (Other varieties were also studied, eg.
>7.5%Bi, however, this alloy seems work the best as of Oct., 1998)
>Ge was added to improve impact resistance.
>This is not a "fix-all" solder. The rel. test range was -35C to 105C.
>I am not sure if test data for wider temp. cycle range is available.
>
>Jong-Kai Lin
>Motorola, SPS.
>==================
>
>
>> Does anyone know the exact composition of the alloy?
>>
>> -----Original Message-----
>> From: Christopher Jorgensen <[log in to unmask]>
>> To: [log in to unmask] <[log in to unmask]>
>> Date: Friday, October 01, 1999 3:55 PM
>> Subject: [LF] Info from Sony Web Site
>>
>> >Sony Creates Lead-Free Solder
>> >There has been considerable interest in the development of a lead-free
>> soldering
>> >compound to lessen the environmental impact of this common manufacturing
>> process.
>> >Sony responded with a unique material that contains no lead yet exhibits
>> better
>> >reliability as well as compatibility with conventional equipment. By adding
>> a small
>> >amount of germanium, Sony achieved dramatic improvements in workability and
>> >reliability. Work is now proceeding toward the practical use of this
>> material.
>> >
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>> >IPCWorks -October 25-28 featuring an International Summit on Lead-Free
>> Electronic
>> >Assemblies.
>> >Please visit IPC's Center for Lead-Free Electronics Assembly
>> >(http://www.leadfree.org ) for additional information.
>> >For technical support contact Gayatri Sardeshpande [log in to unmask] or
>> 847-790-5365.
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>> Leadfree E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
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>> To subscribe/unsubscribe, send a message to [log in to unmask]
>> with following text in the body:
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>> To unsubscribe:   SIGNOFF Leadfree
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>> IPCWorks -October 25-28 featuring an International Summit on Lead-Free
>Electronic
>> Assemblies.
>> Please visit IPC's Center for Lead-Free Electronics Assembly
>> (http://www.leadfree.org ) for additional information.
>> For technical support contact Gayatri Sardeshpande [log in to unmask] or
>847-790-5365.
>> ################################################################

**************************************
Carol A. Handwerker
Chief, Metallurgy Division
NIST
100 Bureau Drive Stop 8550
Gaithersburg MD 20899-8550
Office:(301) 975-6158
Fax:(301) 975-4553
e-mail:[log in to unmask]

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Leadfree E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask]
with following text in the body:
To subscribe:   SUBSCRIBE Leadfree <your full name>
To unsubscribe:   SIGNOFF Leadfree
################################################################
IPCWorks -October 25-28 featuring an International Summit on Lead-Free Electronic
Assemblies.
Please visit IPC's Center for Lead-Free Electronics Assembly
(http://www.leadfree.org ) for additional information.
For technical support contact Gayatri Sardeshpande [log in to unmask] or 847-790-5365.
################################################################

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