Sony announced this new alloy one year ago (Sep/Oct, 1998), not
recently!
It was Sn-2Ag-4Bi-0.5Cu-0.1Ge. (Other varieties were also studied, eg.
7.5%Bi, however, this alloy seems work the best as of Oct., 1998)
Ge was added to improve impact resistance.
This is not a "fix-all" solder. The rel. test range was -35C to 105C.
I am not sure if test data for wider temp. cycle range is available.

Jong-Kai Lin
Motorola, SPS.
==================


> Does anyone know the exact composition of the alloy?
>
> -----Original Message-----
> From: Christopher Jorgensen <[log in to unmask]>
> To: [log in to unmask] <[log in to unmask]>
> Date: Friday, October 01, 1999 3:55 PM
> Subject: [LF] Info from Sony Web Site
>
> >Sony Creates Lead-Free Solder
> >There has been considerable interest in the development of a lead-free
> soldering
> >compound to lessen the environmental impact of this common manufacturing
> process.
> >Sony responded with a unique material that contains no lead yet exhibits
> better
> >reliability as well as compatibility with conventional equipment. By adding
> a small
> >amount of germanium, Sony achieved dramatic improvements in workability and
> >reliability. Work is now proceeding toward the practical use of this
> material.
> >
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> >IPCWorks -October 25-28 featuring an International Summit on Lead-Free
> Electronic
> >Assemblies.
> >Please visit IPC's Center for Lead-Free Electronics Assembly
> >(http://www.leadfree.org ) for additional information.
> >For technical support contact Gayatri Sardeshpande [log in to unmask] or
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> IPCWorks -October 25-28 featuring an International Summit on Lead-Free Electronic
> Assemblies.
> Please visit IPC's Center for Lead-Free Electronics Assembly
> (http://www.leadfree.org ) for additional information.
> For technical support contact Gayatri Sardeshpande [log in to unmask] or 847-790-5365.
> ################################################################