LEADFREE Archives

October 1999

Leadfree@IPC.ORG

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Subject:
From:
"Dr. Hermann Oppermann" <[log in to unmask]>
Reply To:
Dr. Hermann Oppermann
Date:
Mon, 4 Oct 1999 10:45:36 +0200
Content-Type:
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The improvement of solder is related to the addition of small amounts of Germanium. As
I have heared Sony has intelectual properties on this solder and filed a patent. Can
somebody confirm this?
--
Dr. Hermann Oppermann
Fraunhofer IZM
Gustav-Meyer-Allee 25
D-13355 Berlin, Germany
--------------------------------------------------
phone: +49-30-46403-163, -160
Fax:   +49-30-46403-161
email: [log in to unmask]
--------------------------------------------------
Dept. Chip Interconnection Technologies
Group Optoelectronics, HF and Sensor Integration
http://www.izm.fhg.de/
http://www.izm.fhg.de/avt/index.htm
http://www.izm.fhg.de/avt/opperm.htm
--------------------------------------------------


Mike Buetow schrieb:

> In March, at IPC Printed Circuits Expo, Mr. Akikazu Shibata of Sony said that
> it was experimenting with Sn-2Ag-5Bi-0.5Cu-0.1Ge.
>
> I cannot say whether this is the same alloy referred to on the Sony Web site.
>
> Mike Buetow
> IPC
> 2215 Sanders Road
> Northbrook, IL 60062
> 847-790-5335
>
>

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