DESIGNERCOUNCIL Archives

October 1999

DesignerCouncil@IPC.ORG
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Subject:
Re: Wave Solder Pads
From:
Gary Ferrari <[log in to unmask]>
Reply To:
DesignerCouncil E-Mail Forum.
Date:
Thu, 21 Oct 1999 22:52:22 EDT
Content-Type:
text/plain
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text/plain (16 lines) 
Karen,

Robustness of the land pattern may be required to achieve a larger area for a
solder fillet to form. Therefore, the adjustments as recommended in
IPC-SM-782 will grow/shrink the land, but not the location. The "C" dimension
remains the same; the "G" dimension decreases; and the "Z" dimension
increases.

Regards,

Gary Ferrari
Executive Director
IPC Designers Council
860-350-9300
fax 413-771-5386

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