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October 1999

DesignerCouncil@IPC.ORG
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Subject:
Re: Wave Soldering Footprint Guidelines
From:
Ron Luman <[log in to unmask]>
Reply To:
DesignerCouncil E-Mail Forum.
Date:
Tue, 19 Oct 1999 11:37:44 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (24 lines) 
Check out Kemet Surface Mount - Mounting Pad Dimensions and Considerations
for caps.
WWW.KEMENT.COM

> -----Original Message-----
> From: Karen Cardwell [SMTP:[log in to unmask]]
> Sent: Tuesday, October 19, 1999 11:09 AM
> To:   [log in to unmask]
> Subject:      [DC] Wave Soldering Footprint Guidelines
>
> In IPC-SM-782 A (Amendment1) there are guidelines for creating
> wave solder footprints for the Chip Resistors, but no guidelines
> for Chip Capacitors.
>
> Does anyone know what the IPC guidelines are?
>
> Karen Anne Cardwell
> Senior PCB Designer
> Allied Signal InterChip
> 1349 Moffett Park Drive
> Sunnyvale, CA 94089-1134
> tel: (408)962-2240
> fax: (408)962-2252

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