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October 1999

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Subject:	Wave Solder Pads
From:	Karen Cardwell <[log in to unmask]>
Reply To:	DesignerCouncil E-Mail Forum.
Date:	Tue, 19 Oct 1999 09:00:08 -0700
Content-Type:	text/plain
Parts/Attachments:	text/plain (23 lines)

I am looking at IPC-SM-782A/Subsection 8.1/Page 3 or 4.

It states: If a more robust pattern is desired for wave soldering devices
larger that 1608 [0603], add 0.2mm to the Y-dimension, and consider
reducing the X-dimension by 30%.

When the 0.2mm is added to the Y-dimension, does the C-dimension
stay the same, the Z-dimension increase by 0.2mm and the
G-dimension decrease by 0.2mm

or

does the C-dimension increase by 0.2mm,  the Z-dimension increase by
0.4mm and the G-dimension stay the same?

Karen Anne Cardwell
Senior PCB Designer
Allied Signal InterChip
1349 Moffett Park Drive
Sunnyvale, CA 94089-1134
tel: (408)962-2240
fax: (408)962-2252

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