DESIGNERCOUNCIL Archives

October 1999

DesignerCouncil@IPC.ORG
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Subject:
Tin content of HASL
From:
Jack Olson <[log in to unmask]>
Reply To:
DesignerCouncil E-Mail Forum.
Date:
Thu, 14 Oct 1999 17:34:44 -0700
Content-Type:
text/plain
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text/plain (14 lines) 
I've just noticed that our fab notes call for 70% Tin 30% Lead on Hot Air
Solder Level.
This only struck me as odd because at a previous company we used SN70 as a
high temperature solder (I think) for terminal posts, so it wouldn't reflow
when we soldered wires to it using SN60 or SN63.

Is it more appropriate to use SN60 or SN63 for HASL?

Is there some advantage to using SN70?

(Sorry for the cross-posts, but this affects FAB and ASSY as well as DESIGN)

Thanks in advance,  Jack

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