Scott,
Once again, IPC-SM-782 is not very clear with their drawings and/or
information but shows the following, to the best of my interpretation:

Discrete Components - All dimensions appear to be from body of SMT device.
side-to-side = 1.0 mm (0.040 in.)
end-to-end = 0.63 mm (0.025 in.)
side-to-end = 1.0 mm (0.040 in.)
end-to-SMT IC pad = 0.63 mm (0.025 in.)
side-to-SMT IC pad = not specified
end to THD pad = 1.25 mm (0.050 in.)
side to THD pad = 1.5 mm (0.060 in.)

SMT device with pads on four sides -
pad-to-pad = 1.25 mm (0.050 in.)
body-to-body = 0.4 [0.160] Minimum (inconsistency, as presented) with view
angle maximized from top of one device to pad of adjacent device.
pad-to-THD pad = 1.5 mm (0.060 in.)

If further states the following, if you can figure it out:
"The land to land spacing between adjacent components should be 1.25 mm
[0.050 in] clear space all around the edges of printed boards if boards are
tested off the connector or 2.5 mm [0.100 in] minimum if vacuum seal for
testing is used."  I believe this to actually mean the component land to
board edge spacing.

hammering away....
Ray Humphrey, DynaCad Design Services
[log in to unmask]    ||  http://www.dynacad.com/
[log in to unmask]  ||  http://Ray.Humphrey.net/

----- Original Message -----
From: Scott D. Shepard <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, October 14, 1999 6:54 AM
Subject: Re: [DC] Spacing question for assembly p & p


> Here's more info, my question is regarding discrete smd like 0603 and
0805.
>
> Thanks,
>
> Scott
> IDS
>
> "Scott D. Shepard" wrote:
>
> > I don't know this number any more. What are spacing minimums for
components end
> > to end and side by side from the edge of pad to edge of pad (inside
edge)? I'm
> > using .030 (inch) for side by side. If I can go closer this would be
great. Is
> > there even an end to end minimum?
> >
> > TIA
> >
> > Scott
> > IDS
>