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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 21 Oct 1999 07:30:23 -0400 |
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There are probably as many ways to properly etch as there are people doing
it.
We use a fresh solution (less then 8 hours old, more then 5 minutes) of:
- 10 mL DI water
- 15 mL Ammonia (28%)
- 8 mL Hydrogen peroxide (35%)
The most important part was mentioned in the first part of Timothy's
message.
" look for the separation _BEFORE_ etching"
Alain Savard, B.Sc.
Chemical Process Analyst
CAE Electronics Ltd.
e-mail: [log in to unmask]
-----Original Message-----
I would recommend looking for the separation _before_ etching the
microsection. We use an etchant solution of 15 mL 30% ammonia solution, 1 mL
30% hydrogen peroxide, water to make 100 mL. Leave it on for no longer than
5 seconds then rinse it off.
Make it fresh daily, and be careful with the peroxide, it will burn your
skin.
Timothy Reeves
> ----------
> From: Howard Lin
> I want to use microsection to check interconection defect (ICD). But I
> have
> no standard procedure to verify this defect. Should I use microetching on
> microsection coupon? Will microetching cause confuse between ICD and
> normal
> interface between electro'less copper and inner layer copper? Is there any
> standard procedure to do microetching? Any input I will be very
> appreciated.
>
> Howard Lin
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