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Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 4 Oct 1999 15:10:11 -0400 |
Content-Type: | text/plain |
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Hello,
When floating coupons (for eventual crossectioning) on solder multiple times
(with a cool-down to ambient in between), to see if defects appear, should the
sample be turned over for each new float? Is there a procedure or paper that
addresses this question? If anyone is doing this , what is the reason?
Thanks
Rich
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Richard Olsen Telephone (602)-824-8599
Hadco-Phoenix Main (602)-824-8301
5020 South 36th Street Fax (602)-268-7386
Phoenix Arizona Pager (602)-310-6245
85040-2905 Internet [log in to unmask]
USA I make circuit boards,what do you do?
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