Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 15 Oct 1999 17:08:08 -0700 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Jack,
I'd be surprised if your board supplier was really paying attention to
that.. I mean does anyone have a HASL machine set up with Sn70 solder? You
probably got Sn63..the standard HASL solder.
Also, the liquidus for Sn70 is only 378 deg C (vs. 361 deg C for Sn63). It
doesn't seem like that would stay solid in your selective soldering process
without very tight temp. control.
Tim Reeves
> ----------
> From: Jack Olson
> Sent: Thursday, October 14, 1999 5:34 PM
> Subject: Tin content of HASL
>
> I've just noticed that our fab notes call for 70% Tin 30% Lead on Hot Air
> Solder Level.
> This only struck me as odd because at a previous company we used SN70 as a
> high temperature solder (I think) for terminal posts, so it wouldn't
> reflow
> when we soldered wires to it using SN60 or SN63.
>
> Is it more appropriate to use SN60 or SN63 for HASL?
>
> Is there some advantage to using SN70?
>
> (Sorry for the cross-posts, but this affects FAB and ASSY as well as
> DESIGN)
>
> Thanks in advance, Jack
>
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################
|
|
|