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October 1999

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Subject:
From:
"Paul, Fred" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 1 Oct 1999 08:46:55 -0700
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Yes, I have seen this phenomenon at FLUKE.  Fortunately, it is not a
pervasive problem, but it is puzzling.  We have not yet determined the exact
cause.  I will revisit the subject with our Innerlayer Dry Film/Etch Process
Engineer and get back to you, if warranted.

-- Fred

-----Original Message-----
From: Eric Masters [mailto:[log in to unmask]]
Sent: Friday, October 01, 1999 12:06 AM
To: [log in to unmask]
Subject: [TN] Internal shorts


I'm having a rather perplexing problem with shorts on inner layers.  The
short is very small, and occurs mainly on fine line jobs (5/5 mils and
less).
 It also occurs primarily on layers with one ounce copper, although I've
seen
it on half ounce.

The short is very very small; in fact, it is rarely seen at AOI.  Usually,
it
is discovered at final electrical test.  Failure analysis exhibits a very
fine sliver of copper that appears to have broken loose from a trace; it
remains attached at one end and flips across the adjacent circuit.

Cross sections and SEM's of both developed resist and etched layers show a
near vertical sidewall.  Has anyone seen this phenomenon?  Any suggestions?

Eric

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