TECHNET Archives

October 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
Subject:
Re: Board Delamination . . . RT
From:
Chris Evans <[log in to unmask]>
Date:
Fri, 29 Oct 1999 08:10:08 +0100
Content-Type:
multipart/alternative; boundary="openmail-part-0b741ab5-00000002"
MIME-Version:
1.0
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
Parts/Attachments:
BDY.RTF (160 bytes) , BDY.RTF (486 bytes) 
Gaby

Intermetalic formation at the copper / tin lead interface is dependant
on temperature. Having something in a vacumm will not reduce it.

Regards

Chris Evans
MBD UK

ATOM RSS1 RSS2