TECHNET Archives

October 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Mime-Version:
1.0
Sender:
Subject:
From:
Eric Christison <[log in to unmask]>
Date:
Tue, 26 Oct 1999 10:53:35 -0500
Content-Transfer-Encoding:
7bit
Content-Type:
text/plain
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Eric Christison <[log in to unmask]>
Parts/Attachments:
text/plain (44 lines)
Alain,

Just a thought. If you dried the boards at room temperature, 0%RH, would this
reduce their reliability?



> It increases cross linking inside the epoxy of the laminate,
> making is slightly more brittle and harder every time you
> bake it. It alsoi ncreases the speed of tin oxide formation,
> in effect it ages the board.
>
> It has also been suggested that a high temperature bake
> (> Tg) may cause warpage in a pressed board.
>
> Alain Savard, B.Sc.
> Chemical Process Analyst
> CAE Electronics Ltd.
> e-mail: [log in to unmask]
>
> -----Original Message-----
>
> Why does baking the board  reduce
> the reliability and life expectancy of the board?
>



Eric Christison

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2