Mime-Version: |
1.0 |
Sender: |
|
Subject: |
|
From: |
|
Date: |
Tue, 26 Oct 1999 10:53:35 -0500 |
Content-Transfer-Encoding: |
7bit |
Content-Type: |
text/plain |
Reply-To: |
|
Parts/Attachments: |
|
|
Alain,
Just a thought. If you dried the boards at room temperature, 0%RH, would this
reduce their reliability?
> It increases cross linking inside the epoxy of the laminate,
> making is slightly more brittle and harder every time you
> bake it. It alsoi ncreases the speed of tin oxide formation,
> in effect it ages the board.
>
> It has also been suggested that a high temperature bake
> (> Tg) may cause warpage in a pressed board.
>
> Alain Savard, B.Sc.
> Chemical Process Analyst
> CAE Electronics Ltd.
> e-mail: [log in to unmask]
>
> -----Original Message-----
>
> Why does baking the board reduce
> the reliability and life expectancy of the board?
>
Eric Christison
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################
|
|
|