TECHNET Archives

October 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Mime-Version:
1.0
Sender:
Subject:
From:
Joseph T Slanina <[log in to unmask]>
Date:
Wed, 13 Oct 1999 11:46:19 -0500
Content-Type:
text/plain; charset=us-ascii
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
Parts/Attachments:
text/plain (29 lines)
I am looking for information on a product that is called "Copper Tex" paper
or slip sheets. I believe that this a copper inhibitor product that is used
by interleaving between cleaned flexible circuit product to minimize
oxidation of copper prior to coverlay lamination.

I need a vendor name and telephone number.




************************************************************
AlliedSignal Federal Manufacturing & Technologies
This e-mail message has been scanned.
************************************************************

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2