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October 1999

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From:
"Ingemar Hernefjord (EMW)" <[log in to unmask]>
Date:
Thu, 7 Oct 1999 08:42:49 +0200
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"Brocious, Dave A" <[log in to unmask]>
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"TechNet E-Mail Forum." <[log in to unmask]>, "Ingemar Hernefjord (EMW)" <[log in to unmask]>
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Hi Dave,
when we needed such specials, we went to Arlon, duPont and Rogers. They know most about how to make such 'clads'. You certainly have suitable hydraulic isostatic pressure units for bringing aluminium foils on boards with a duPont film (they have many). Or 3M. Rather simple process. We bought an equipment and tried ourselves, but no economy in that, so we bought from outside. /Ingemar


Hello,
        I'm looking for info on selective aluminum plating on a printed
circuit board.  Has anyone done it? Method of attachment (sputter, direct
bond, etc...)? Material requirements?

Thanks in advance,
Dave Brocious
Lockheed Martin
Advanced Development
215-497-1732

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