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Wed, 6 Oct 1999 14:28:54 +0000 |
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Matthias Mansfeld Elektronik |
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On 6 Oct 99 at 7:53, Lustig, Steven K.. wrote:
[......]
>.. as well as a strip where we
> bond a part subsequently.
[...]
.. just curious - do you mean chip bonding (bare dies), any glue
operations with standard components, or wire bonding?
I'm looking for a reliable process to protect wire bonding areas
(mostly immeesion NiAu for Al wire bonding) with something like a
temporary soldermask against any dirt from SMD process, instead of
expensive cleaning processes like plasma...
Thanks, regards
Matthias Mansfeld
-----------------------------------------------
Matthias Mansfeld Elektronik
* Printed Circuit Board Design and Assembly
Am Langhoelzl 11, D-85540 Haar, GERMANY
Phone: +49-89-4620 0937, Fax: +49-89-4620 0938
E-Mail: [log in to unmask]
Internet: http://www.mansfeld-elektronik.de
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