I've used 3-10 u" over 120 u" Ni over copper for some time. So do the
companies with which I work and use as suppliers.

Earl Moon
----- Original Message -----
From: Gary Crowell <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, September 02, 1999 10:38 AM
Subject: [TN] Immersion Gold - How to specify?


> We're doing our first board using high pincount BGA's, and I understand
> that we should be an immersion gold finish to get the flatness needed
> for BGA assembly.  My question is, how do I specify this type of finish
> to the fab house?  I assume thickness is one of the factors; what is
> typical and what are the considerations in thickness spec?  What else
> needs to be specified?
>
> The board in question is 9x14", 18 layers, a prototype build on a board
> that will never see high volumes (about 100 units max lifetime
> production).  Environment is labratory, internal company use only.
>
> TIA
>
> Gary Crowell
> Micron Technology
>
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