TECHNET Archives

September 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Rose, Daniel B" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 30 Sep 1999 13:44:44 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (23 lines)
I have proto run requirements to package supplied die into a 352 BGA.  If
anyone can point me to some domestic supplier, it would be appreciated.

Dan Rose
303.673.6976 phone
303.673.3466 fax
StorageTek
INFORMATION made POWERFUL

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2