Hi Earl,

I agree that minimum is minimum and average is average.
We have specifications that are often different from the IPC and the Master
Engineering Drawing and Purchase Order do take precedence. If you look at Ken's
question though, you will see that he asks where he should be looking to get a
measurement method standard, that was my answer.

Alain Savard

>>> pod <[log in to unmask]> 09/29/99 05:53pm >>>
Minimum is still minimum. Average is still average. Other requirements must
be considered as we all know. Some are two voids in the same plain as
unacceptable, those elements reducing hole wall plating thickness below that
specified (glass fiber protrusion and so on). This is age old stuff and the
lady from the lab, or? knows the stuff.

Earl Moon
-----
> Hi Ken,
>
>   Verify the thickness as per IPC-TM-650, method number 2.1.1. This is
suggested
> by the IPC A-600, section 3.3.6.
>
>   Verify also IPC-6012, section 3.2.6.2 and table 3-2 (under average
copper, and
> minimum thin areas).
>
>   Although in the present case, it does seem like a reject.
>
> Alain Savard, B.Sc.
> CAE Electronics Ltd.
>
> >>> Ken Patel <[log in to unmask]> 09/29/99 01:42pm >>>
> If my requirement for the copper plating is 0.001" minimum (as spelled out
> on my fab drawing) and if I am reading it between .0004"-.001", is it
> rejects or not?. I tried to look at IPC-6012 which is calling out avg
copper
> thickness. I don't how easy to get ave #. This is clearly a reject to me.
> But I am looking for an expert opinion on the subject. Via Hole in
question
> is 16 mil +3 mil / -10 mils.
>

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