TECHNET Archives

September 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Joseph H. Smith" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 29 Sep 1999 14:45:11 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (29 lines)
     I have a few questions that I could use some help with:

     1) This note exists on a FLEX fab drawing: "During plating of vias all
     areas shall be masked with plating resist except those pads indicated
     as pads common."  Does it refer to selective plating?  Can anyone
     please explain this and why a design would need this type of process?

     2) On this same fab drawing "bend seam lines" are called out on areas
     over traces.  Can't this break the traces-especially if the selective
     type plating is used (doesn't this process make the flex more
     brittle)? If bends are required in a flex, what options am I to look
     for?

     Thank you.

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2